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Semiconductor Wafer Defect Detection Equipment Wafer Defect Detection Series
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting.
It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications.
Price Range: USD $15,000 – USD $35,000.
FARLEY LASERLAB AUTO: Wafer Defect Detection Equipment
Semiconductor Wafer Defect Detection Equipment Wafer Defect Detection Series
For the mid stream wafer manufacturing enterprises and downstream packaging and testing enterprises in the semiconductor industry chain, a multi-channel bright and dark field parallel detection system developed independently is adopted to detect the appearance defects of semiconductor wafers and grains with graphics.
Semiconductor Wafer Defect Detection Series
This wafer defect inspection machine applies to 4–8 inch patterned wafers, detecting various surface flaws with 0.2–0.8μm ultra-high resolution and fast speed, tailored for semiconductor wafer manufacturing and packaging testing.
Features:
Supports 4–8 inch patterned wafers
0.2–0.8μm ultra-high resolution
Self-developed multi-channel detection system
Detects multiple wafer surface defects
Efficient patterned wafer inspection
For semiconductor packaging & testing
Wafer Defect Detection Equipment – Technical Specifications
| Item | Main parameters | |
|---|---|---|
| General parameters | Wafer size | 4 “, 6” (Iron frame with blue film) |
| Number of boxes | 2 pcs | |
| Loading and unloading method | Robot, mapping scanning | |
| Motion platform | X stroke 200mm, repetitive accuracy 10μm Y stroke 45mm，repetitive accuracy 10μm Z strooke 15mm，repetitive accuracy 5μm | |
| Capacity | 4″ , 25WPH 6″ , 20WPH | |
| Detection performance | Test accuracy | 3 μm |
| Camera | High resolution industrial camera | |
| Lens | Microlens | |
| Light source | Patented light source | |
| Defect marking | Automatic dotting | |
| Environment requirement | Power supply specification | AC220V， 50Hz |
| Air source requirements | 0 .5-0 .7Mpa compressed air, without obvious water vapor and grease | |
| Using environment | Temperature: 15-40 ℃. Humidity requirement: 30% – 70%, no frost | |
| Overall size | 2000mm*1200mm*2250mm | |
Available in a variety of sizes
This equipment can be used for 4-8 inch patterned wafers.
Can detect a variety of defects
Detect defects such as scratch, back collapse, color difference, crack, scratch, metal residue and metal loss.
High precision resolution
System resolution: 0.2-0.8 μ m.
Fast detection speed
Patterned wafer: 15 minutes / wafer when the number of defects is less than 200.
Samples Display
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