MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system




This device cuts various ceramic materials with high efficiency and precision via auto loading and unloading. It offers professional laser and automation solutions for PCB, SMT, FPC, IC packaging and ceramic substrate manufacturing.

Supports multiple ceramic materials processing
Automatic loading and unloading design
Professional solutions for electronics industries
Integrated automation and full-process control
Non-contact stress-free laser processing
High-efficiency and high-precision machining
Applications:
| Item | Main Parameters | |
|---|---|---|
| Working table size | Circular working table | Ø6″ |
| X axis | Available track | 235mm |
| Cutting stroke | 0.1—800mm/s | |
| Y axis | Available track | 145 mm |
| Stroke resolution | 0.0005mm | |
| Repetitive positioning accuracy | 0.001mm | |
| T axis | Angle range | 335°deg |
| Repetitive positioning accuracy | 0.001° | |
| Function | Automatic positioning of workpiece | Standard configuration |
| Automatic alignment of workpiece | Standard configuration | |
| NCS height measurement | Standard configuration | |
| Overall dimension | Overall size | 494mm*882mm*1668mm |
| Weight | 500Kg | |


This equipment is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants.
For the pan semiconductor and 3C industries, it is applied to various types of identification of Si, Gan, SiC, glass and surface coating materials, and is applicable to 8-inch and above wafers.
SiC wafer laser hidden cutting equipment, internal modification to form a crack layer, no tool loss, no frontal damage, suitable for the mass production of vehicle-grade SiC chips.
FARLEY LASERLAB LUA3200 Ultra-efficient Fully Automated Wafer Laser Annealing Machine:The EFEM system pre-positions the wafer, a customized laser annealing head and precision motion platform work together to anneal the entire SiC wafer backside metal (Ni or T layer), ensuring good ohmic contact,