MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
Semiconductor Substrate Defect Detection Equipment Defect Detection Series
Facing the upstream raw material manufacturing enterprises and the midstream wafer manufacturing enterprises in the semiconductor industry chain, the independent developed optical bright and dark field detection system is used to detect the appearance defects of semiconductor raw materials, epitaxial wafers and patterned wafers.
FARLEY LASERLAB AUTO: Defect Detection Equipment
Semiconductor Substrate Defect Detection Equipment Defect Detection Series
Facing the upstream raw material manufacturing enterprises and the midstream wafer manufacturing enterprises in the semiconductor industry chain, the independent developed optical bright and dark field detection system is used to detect the appearance defects of semiconductor raw materials, epitaxial wafers and patterned wafers.
Semiconductor Substrate Defect Detection Series
This wafer inspection machine suits 4–8 inch various wafers, detects multiple surface defects with 1–10μm high resolution and fast speed, serving semiconductor raw material and wafer manufacturers.
Features:
Compatible with 4–8 inch various wafers
1–10μm high resolution
Bright & dark field optical system
Detects multiple surface defects
Fast wafer inspection speed
For semiconductor wafer manufacturing
Defect Detection Equipment – Technical Specifications
| Item | Main parameters | |
|---|---|---|
| General parameters | Wafer size | Standard 4 “, 6” (expandable 4 “- 8”) |
| Number of boxes | Double-deck, 14 pcs | |
| Loading and unloading method | Robot, mapping scanning | |
| Motion platform | Y stroke 350mm，repetitive accuracy 10μm Z strooke 8mm，repetitive accuracy 5μm | |
| Capacity | 4″ , 140WPH 6″ , 120WPH | |
| Detection performance | Test accuracy | 7 μm |
| Camera | High resolution industrial camera | |
| Lens | HD industrial lens | |
| Light source | Patented light source | |
| Environment requirement | Power supply specification | AC220V， 50Hz |
| Air source requirements | 0 .5-0 .7Mpa compressed air, without obvious water vapor and grease | |
| Using environment | Temperature: 15-40 ℃. Humidity requirement: 30% – 70%, no frost | |
| Overall size | 1800mm*1300mm*2250mm | |
Available in a variety of sizes
Suitable for 4-8 inch wafers, substrates, epitaxial wafers and patterned wafers.
Can detect a variety of defects
Detect particles, pits, bumps, scratches, stains, cracks and other defects.
High precision resolution
System resolution: 1-10 μ m.
Fast detection speed
No pattern wafer: 180 seconds / wafer when the number of defects is less than 200.
Sampls Display
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