MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
PCB & Microelectronics Industry
PCB & Microelectronics Laser Manufacturing Solutions
Product-led laser solutions for PCBA depaneling, PCB/FPC marking, FPC drilling, FPC cutting, IC substrate marking, ceramic substrate cutting, IC package marking, and process traceability.
Designed for high-precision, low-stress processing, automated production integration, and quality control in PCB, FPC, IC substrate, and microelectronics manufacturing.
PCBA Depaneling
PCB/FPC Marking
FPC Drilling | FPC Cutting
IC Substrate
Ceramic Substrate
Traceability
Precision laser processing for PCB and microelectronics
FARLEY·LASERLAB provides PCB and microelectronics laser solutions covering PCBA depaneling, PCB/FPC marking, FPC drilling, FPC cover film cutting, ceramic substrate cutting, IC substrate X-Out marking, IC package marking, inspection support, automation integration, and traceability management.
1
PCBA Depaneling
High-precision laser cutting for PCBA production lines.
2
PCB/FPC Marking
Coding, reading detection, and traceability for PCB and FPC boards.
3
FPC Drilling
High-speed micro-hole drilling for FPC and rigid-flex boards.
4
FPC Cutting
Cover film cutting, shape cutting, window half cutting, and RFPC cover opening.
5
IC Substrate & Packaging Marking
X-Out marking, IC surface marking, OCR inspection, and MES data feedback.
6
Ceramic Substrate Cutting
Automatic cutting for alumina, zirconium oxide, aluminum nitride, silicon nitride, and related ceramic substrates.
Core Equipment
SMT Laser Depaneling
SMT laser depaneling solutions support PCBA production lines with offline or inline configurations and fully automatic laser cutting through high-precision control and industrial vision systems.
Value Points
No dust and deformation | Suitable for PCBA production lines | MES data interoperability
Recommended Products
SMT Laser Depaneling Machine
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SMT Double Head PCB Laser Marking
SMT double-head PCB laser marking solutions support automatic laser coding, reading detection, and process control for PCBA production lines.
Value Points
Supports one-dimensional and two-dimensional codes | Compatible with PCB/FPC materials and metal shielding covers | MES interconnection and data anti-duplication
Recommended Products
SMT Double Head PCB Laser Marking Machine
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IC Substrate X-Out Laser Marking
IC substrate X-Out laser marking solutions are used for automatic identification and laser marking of scrap units on carrier products.
Value Points
Supports scrap-unit identification | Improves subsequent process identification | Supports yield and process efficiency improvement
Recommended Products
IC Substrate X-Out Laser Marking Machine
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High-Speed FPC Laser Drilling
High-speed FPC laser drilling solutions support high-precision micro-hole drilling for FPC, rigid-flex boards, and related materials.
Value Points
High-speed micro-hole processing | Supports blind holes in one hit | Suitable for FPC shape and cover film processing
Recommended Products
High-Speed FPC Laser Drilling Machine
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Picosecond UV FPC Laser Cutting
Picosecond UV FPC laser cutting solutions are used for FPC cover film cutting, FPC shape cutting, FPC window half cutting, and RFPC cover opening.
Value Points
High accuracy and stability | Controlled heat-affected zone (HAZ) for consistent cutting quality | Supports no blackening and no carbonized dust requirements
Recommended Products
FPC Pico UV Laser Cutting Machine
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Ceramic Substrate Laser Cutting
Ceramic substrate laser cutting solutions support high-efficiency and high-precision automatic cutting for alumina, zirconium oxide, aluminum nitride, silicon nitride, and other ceramic materials.
Value Points
High-precision ceramic cutting | Automatic loading and unloading | Suitable for ceramic substrate processing
Recommended Products
Ceramic Substrate Laser Cutting Machine
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Fully Automated IC Packaging and Laser Marking System
Fully Automated IC Packaging and Laser Marking System solutions support packaged IC surface marking with automatic loading and unloading, automatic width adjustment, OCR inspection, MES data analysis, and data feedback.
Value Points
Automatic IC surface marking | OCR mark detection | MES data analysis and feedback
Recommended Products
Full-automatic IC Packaging and Laser Marking
Get a QuoteAdvanced Packaging & Smart Manufacturing
Glass substrate processing supports micro-hole drilling, scribing, and precision cutting for advanced packaging and high-density microelectronics applications.
SMT and IC Substrate Laser Processing, Packaging and Inspection Solution
SMT and IC substrate manufacturing can be positioned around laser marking,depaneling, sorting, intelligent inspection, packaging, and traceability-oriented process integration.
Value Points
Laser processing, packaging and inspection |IC substrate process support | Traceability and quality control
Recommended Combination
Full-automatic IC Packaging and Laser Marking Series
IC Substrate X-Out Laser Marking Series
SMT Double Head PCB Laser Marking Series
Laser Processing, Packaging and Inspection Support for PCB and IC Substrate Manufacturing
FARLEY·LASERLAB supports SMT and IC substrate manufacturing with laser marking, depaneling, sorting, intelligent inspection, packaging, and traceability-oriented process integration.
Value Points
Laser marking and depaneling | Intelligent inspection and packaging | Traceability-oriented process integration
Recommended Products
View PCB Smart Manufacturing Support
Explore Smart Factory
Integrated capabilities for PCB and microelectronics manufacturing
FARLEY·LASERLAB combines precision laser processing equipment, automation modules, inspection support, and traceability-oriented manufacturing capabilities for PCB and microelectronics production.
Precision Laser Processing
SMT/IC Substrate Automation
Traceability and Inspection Support
Why FARLEY·LASERLAB
Integrated capabilities for PCB and microelectronics manufacturing
FARLEY·LASERLAB combines precision laser processing equipment, automation modules, inspection support, and traceability-oriented manufacturing capabilities for PCB and microelectronics production.
Precision Laser Processing
SMT/IC Substrate Automation
Traceability and Inspection Support
Contact
Discuss PCB and microelectronics laser processing solutions
Connect with our team to explore laser depaneling, marking, drilling, cutting, IC substrate, ceramic substrate, and smart manufacturing solutions for PCB and microelectronics applications.