Semiconductor & Hard and Brittle Materials Laser Manufacturing Solutions

Wafer laser annealing supports backside metal annealing for SiC wafers through coordinated wafer handling, laser annealing, and precision motion control.

Value Points

Supports SiC wafer backside metal annealing | Helps improve ohmic contact | Designed for fully automated wafer processing

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Fully Automated Wafer Laser Annealing Machine

SiC wafer modification and cutting solutions use custom ultrafast lasers, high-precision motion platforms, dynamic focus compensation, and vision positioning for stealth dicing and die separation.

Value Points

Suitable for 6–8 inch wafers | Supports internal modification and die separation | Uses vision positioning and automated wafer handling

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Fully Automatic SiC Wafer Modification and Cutting Equipment

SiC processing supports fully automatic wafer modification and cutting for 6–8 inch wafers, using ultrafast lasers, high-precision CCD vision, dynamic focus compensation, and automated wafer handling.

Value Points

Internal modification / stealth dicing | No front-side damage | Dynamic focus compensation | SEMI-standard automation | Supports advanced third-generation semiconductor manufacturing

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Fully Automatic SiC Wafer Modification and Cutting Equipment

Wafer laser modified cutting supports internal modified cutting of silicon-based wafers for 8-inch and above chip packaging and testing applications.

Value Points

High-quality modified cutting | Small edge collapse and low surface damage | Supports high-efficiency wafer separation

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Wafer Laser Stealth Dicing Equipment

Wafer slotting and laser scribing solutions support precision processing for low-k wafers, silicon-based GaN wafers, GPP wafers, and silicon or compound semiconductor wafers.

Value Points

Supports slotting and precision scribing | Suitable for semiconductor wafer processing | Covers nanosecond and picosecond scribing options

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Wafer Laser Slotting Equipment for Semiconductors

Automatic wafer laser slotting equipment can support precision slotting and advanced wafer processing scenarios within semiconductor manufacturing.

Value Points

Wafer slotting | Precision laser processing | Semiconductor manufacturing support

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Wafer Laser Slotting Equipment for Semiconductors

Wafer laser marking solutions support full-automatic marking for semiconductor wafers using wafer handling, coaxial vision positioning, and laser marking technology.

Value Points

Supports 2–6 inch wafer marking | Automatic positioning and edge finding | Supports identification and traceability

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Wafer Laser Marking Equipment for Semiconductors
Fully Automated Wafer Marking Equipment

Semiconductor wafer defect detection equipment supports inspection of patterned wafers and wafer surfaces for scratches, cracks, color differences, metal residue, and other defects.

Value Points

Suitable for 4–8 inch patterned wafers | Detects multiple surface defects | Supports high-resolution inspection

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Semiconductor Wafer Defect Detection Equipment

Semiconductor substrate defect detection equipment supports defect inspection for wafers, substrates, epitaxial wafers, and patterned wafers.

Value Points

Applicable to multiple wafer and substrate types | Detects particles, pits, scratches, stains, and cracks | Supports upstream and midstream quality control

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Semiconductor Substrate Defect Detection Equipment

Wafer thickness measuring equipment uses spectral confocal measurement to detect the size and flatness of semiconductor raw and epitaxial wafers.

Value Points

Supports raw and epitaxial wafer measurement | Focuses on size and flatness detection | Suitable for upstream semiconductor material production

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Semiconductor Wafer Thickness Measuring Equipment