MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
Full Automatic Wafer Marking Equipment Wafer Marking Series
For the pan semiconductor and 3C industries, it is applied to various types of identification of Si, Gan, SiC, glass and surface coating materials, and is applicable to 8-inch and above wafers.
FARLEY LASERLAB AUTO: Wafer Marking Equipment
Full Automatic Wafer Marking Equipment Wafer Marking Series
For the pan semiconductor and 3C industries, it is applied to various types of identification of Si, Gan, SiC, glass and surface coating materials, and is applicable to 8-inch and above wafers.
Full Automatic Wafer Marking Equipment Wafer Marking Series
This picosecond laser marking machine features low thermal impact and supports multiple code formats. It enables MES data uploading, fits 8–12 inch wafers with full auto loading/unloading, and adopts a marble base for stable performance, ideal for semiconductor and 3C material marking.
Features:
Picosecond laser, low thermal impact
MES system data uploadable
Full auto loading & unloading
Multi-format marking supported
Compatible with 8–12 inch wafers
Marble base for high stability
Full Automatic Wafer Marking Equipment– Technical Specifications
| HD S2113 | Main parameters | |
|---|---|---|
| Laser | Average output power | ≥5W（optional） |
| Pulse width | ＜10ps | |
| Laser wavelength | Lamp Source | |
| Linear motor parameters CCD positioning system Code reading system | Motor stroke | 450*650mm |
| Pixel | 12 million pixels, positioning accuracy 0.003mm | |
| Pixel | 600 million pixels | |
| Machining accuracy | Positioning accuracy | ≤±0.03mm |
| Machining dimensional accuracy | ≤±0.02mm | |
| Handling robot | Number of robot arms | Single / double arm |
| Finger | Clamping / adsorption | |
| Others | Charging machine | Yes |
| Mapping | Yes | |
| Edge finder | 8- 12inch is compatible | |
| General indicators | Cleanliness level | Hundred level 500 |
| Size | 1900mm*1800mm*1950mm（main body） | |
| Weight | About 2.5t | |
Full Automatic Wafer Marking Equipment
Wafer Marking Series
- Support information uploading
Equipped with code reading module to support information uploading to MES system.
- High compatibility and automation
The equipment is compatible with 8-12inch wafers, fully automatic loading and unloading.
- Automatic switch, saving labor
Equipped with load mechanism, which can automatically open / close the wafer cassette.
- Marble base, high stability
Marble base, stable optical path system, thus ensuring high-quality optical transmission.
Samples Display
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