MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
This equipment is designed for 8-inch and above chip sealing and testing plants, and is applied to low-k wafers and silicon-based Gan wafers with 40nm and below in the semiconductor industry.




For 8-inch+ semiconductor wafers including low-k and GaN, this machine uses ultra-short pulse laser and spatial light modulation, integrating coating, slotting and cleaning with high processing quality and efficiency.

Fits 8-inch and above wafers
Ultra-short pulse low thermal impact
Adjustable laser shaping spot
Supports low-k & GaN wafers
High-precision visual positioning
Integrated coating, slotting and cleaning
| Item | Main parametetrs | |
|---|---|---|
| Laser | Center wavelength | ~532nm |
| Cutting head | Spatial light shaping module | |
| Performance | Effective working stroke | 300x400mm(optional) |
| Repetitive positioning accuracy | ±1μm | |
| Visual positioning | Automatic visual positioning | |
| Slot depth | ≥10µm | |
| Others | Wafer size | 8 inch (12inch is compatible ) |
| Processing process | Protective liquid coating – wafer grooving – cleaning | |
| Processing object | Low – K wafers, silicon-based Gan, etc | |

Use ultra short pulse processing to reduce edge collapse, delamination and thermal impact, and adopt high-precision visual positioning to ensure the slotting position
Based on spatial light modulation technology, the size and shape of the shaping spot can be adjusted, and the laser energy utilization rate is high and the response is fast.


Integrated protective liquid coating, wafer slotting and cleaning module.




Have Questions? Talk to Our Experts!
﹀
FARLEY LASERLAB LUA3200 Ultra-efficient Fully Automated Wafer Laser Annealing Machine:The EFEM system pre-positions the wafer, a customized laser annealing head and precision motion platform work together to anneal the entire SiC wafer backside metal (Ni or T layer), ensuring good ohmic contact,
SiC wafer laser hidden cutting equipment, internal modification to form a crack layer, no tool loss, no frontal damage, suitable for the mass production of vehicle-grade SiC chips.
This equipment is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants.
This equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting speed and high positioning accuracy. The equipment is equipped with a high-precision CCD vision system