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Semiconductor Wafer Thickness Measuring Equipment Wafer Thickness Measuring Series
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting.
It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications.
Price Range: USD $15,000 – USD $35,000.
FARLEY LASERLAB AUTO: Wafer Thickness Measuring Equipment
Semiconductor Wafer Thickness Measuring Equipment Wafer Thickness Measuring Series
Facing the raw material production enterprises in the upstream of the semiconductor industry chain, the independently developed spectral confocal measurement system is used to detect the size and flatness of semiconductor raw and epitaxial wafers.
Semiconductor Wafer Thickness Measuring Series
This spectral confocal measuring device is for 4–8 inch raw, substrate and epitaxial wafers. It delivers ±1μm high accuracy with fast 30s per piece testing, ideal for semiconductor raw material manufacturers.
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Features:
Fits 4–8 inch various wafers
±1μm high thickness accuracy
Fast 30s per wafer measurement
Spectral confocal measurement system
0.2μm excellent repeatability
Wafer size and flatness inspection
Wafer Thickness Measuring Equipment – Technical Specifications
| Item | Main parameters | ||
|---|---|---|---|
| General parameters | Wafer size | 4″ , 6″ | |
| Number of boxes | Double-deck, 14 pcs | ||
| Loading and unloading method | Robot, mapping scanning | ||
| Motion platform | X stroke150mm， Y stroke150mm， | Repetitive accuracy ±0. 1 μm Repetitive accuracy ±0. 1 μm | |
| Capacity | 4″ , 240WPH 6″ , 220WPH | ||
| Detection performance | Detection function | Wafer (coated wafer) thickness, TTV, warpage | |
| Thickness test accuracy | ±0 .5 μ m. Repeatability: 0.1 μ M (25 pieces continuously tested, 5 points for each piece) | ||
| Thickness range | ± 1 mm | ||
| TTV test accuracy | ± 0.5 um, repeatability: 0.2 μ m | ||
| Warpage test accuracy | ± 2 μ m. Test range: ± 600 μ m. Repeatability: 1 μ m | ||
| Environment requirement | Power supply specification | AC220V,50Hz | |
| Air source requirements | 0.5-0.7mpa compressed air, without obvious water vapor and grease | ||
| Using environment | Temperature: 15-40 ℃. Humidity requirement: 30% – 70%, no frost | ||
| Overall size | 1800mm*1300mm*2250mm | ||
Wide application range
Used for 4-8 inch original wafer, substrate and epitaxial wafer of various materials and polishing conditions.
High measurement accuracy
Thickness range: 0-1mm measurement accuracy: ± 1 μ M repetition accuracy: 0.2 μ m.
Short measurement time
Measurement time: 30s / PCS (according to the customer’s detection trajectory).
Samples Display
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