MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
High-Speed FPC Laser Drilling Series Machine
Developed for high-speed, high-precision drilling applications for soft and rigid combination boards and other materials, with high precision, high efficiency, micro-hole processing, and convenient shape change, as well as processing for shape and cover film cutting.
FARLEY LASERLAB AUTO: FPC Laser Drilling Machine
High-Speed FPC Laser Drilling Series Machine
Developed for high-speed, high-precision drilling applications for soft and rigid combination boards and other materials, with high precision, high efficiency, micro-hole processing, and convenient shape change, as well as processing for shape and cover film cutting. Original patented technology – FPC Laser Shield Laser drilling Technology, developed ultraviolet high-speed drilling equipment to achieve blind holes in one hit.
High-Speed FPC Laser Drilling Series Machine
This laser drilling equipment is designed for high-speed, high-precision drilling of rigid-flex boards, with micro-hole processing capability and one-hit blind hole drilling via patented UV technology; it also supports shape and cover film cutting, and offers integrated laser solutions for PCB, FPC, IC substrate and other related industries.
Features:
High-speed & high-precision drilling
Patented UV laser drilling tech
Non-contact, stress-free processing
Micro-hole & blind hole processing
Supports shape & cover film cutting
Integrated PCB industry solutions
High-Speed FPC Laser Drilling Series Machine – Technical Specifications
Original patented technology – FPC Laser Shield Laser drilling Technology, developed ultraviolet high-speed drilling equipment to achieve blind holes in one hit.
With the development of printed circuit boards towards refinement, high density and high performance, precision lasers are more and more widely used in the downstream industry of circuit boards because of their non-contact, stressless, and flexible processing characteristics. HGLASER PCB Microelectronics Division provides integrated solutions for the upstream and downstream industries of PCB such as laser cutting, marking, automation, and full-process traceability management.
| Project | Main technical parameters | |
|---|---|---|
| Light road | Light source | UV |
| Laser wavelength | 355nm | |
| Average power | >15W | |
| Focus on the size of the light spot | <15 um | |
| Whole machine processing performance | The maximum scanning range of the vibrating mirror | 40x40mm |
| Processing method | Flying drilling processing | |
| The overall processing accuracy of the system | ±20 um | |
| The maximum surface of the adsorption platform | 620mm x 520 mm | |
| Power monitoring module | Have | |
| Equipment size (length*width*height) | 1500*1600*1800mm | |
| Processing drawing file processing | DXF, Drill | |
| Equipment performance indicators | Laser light spot | <15 um |
| Processing quality | True roundness ≥90%; the upper and lower aperture ratio of the through hole > 85% Upper and lower aperture ratio of blind hole: aperture diameter 50um> 80%, aperture diameter 100um> 85% | |
| Process patterns | Round hole, special hole | |
High efficiency
High-speed and high-precision flying drilling processing, and the algorithm optimization of the software for the shortest path, the efficiency of through-hole processing is improved by 20%.
Easy to operate
Visual file editing, making new templates takes 5-10 minutes at the earliest.
Rich in functions
Multiple products can be positioned and processed at the same time; custom characters on the edge of the board, QR code trace marking function.
Multi-functional software
Support whole board positioning, subdivision positioning processing; automatic increase and shrinkage compensation; authority classification management, etc.
Device expansion
Support RTR expansion for efficient automated production.
Good stability
Automatic detection and adjustment of laser power to ensure the stability of product processing.
Samples Display
Related products
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