MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
FPC laser cutting machines adopt high-performance cold laser source, perfectly achieving the board shape cutting, contour cutting, drilling and cover film cutting and other ultra-fine processing. The equipment is mainly used in precision cutting and marking for flexible circuit boards, rigid circuit boards, rigid-flexible circuit boards.




Equipped with high-performance UV cold laser source, CCD positioning and self-developed control software, this FPC laser cutting machine achieves micron-level precision cutting, drilling and marking for FPC, PCB, rigid-flex boards and cover films, featuring mould-free one-step forming, automatic positioning and high processing efficiency.
High-performance UV cold laser source
Mould-free one-step forming, cost-saving
Supports FPC, PCB, rigid-flex board and cover film
Precise CCD image positioning technology
Micron-level high processing accuracy
Automatic positioning & focusing for high efficiency
Adopted with high-performance UV laser cold light source, high-precision CCD image positioning technology and self-developed visual laser control software, the Flexible PCB laser cutting machine from HGLASER perfectly implements contour cutting, drilling and marking of FPC and PCB, and precision processing of composite membrane.
| Laser | Laser Source | 355 nm UV |
|---|---|---|
| Power | 10 W | |
| Coaxial Video Positioning | B/W CCD | |
| Scan Range | 60×60 mm | |
| Focused Spot Diameter | <20 um (UV Laser) | |
| Auto Focus System | Z axis auto focus | |
| Focus Control Precision | 0.01 mm | |
| Main structure configuration | X-Y Working Platform | Ac servo motor |
| Base | High-precision granite platform | |
| Travel Range | 300×400 (Optional size range) | |
| Platform Motion Resolution | 0.5 um | |
| Overall Control System | IPC | |
| Assisted Control System | Mitsubishi PLC | |
| CCD Lighting Source | 620 nm red light LED | |
| External Auxiliary Device | Negative pressure air blower, dusting system | |
| Processing Characteristics | Processing Size Range | 360×460 mm |
| Min Linear Width | 20 um | |
| Stitching Accuracy | ±5 um | |
| Scanning Head Correction Accuracy | ±5 um | |
| X-Y Table Correction Accuracy | ±4 um | |
| CCD Matching Accuracy | 7 μm | |
| Processing Accuracy | ±4 micrometers | |
| Processing Thickness | <1 mm | |
| Environmental Conditions | Power Supply | AC 220V±10%,50HZ,1P,3KVA |
| Fixture | Customize to the needs | |
| Document Format | DXF, GBR, etc. | |
| Environment Temperature | 15-30°(constant temperature for high precision) | |
| Environment Humidity | <50% | |
| Weight | 1500KG | |
| Mainframe Size | 1350mm(W) ×1050mm(D) ×1950(H) |

Precision two-dimensional worktable and full closed-loop CNC system ensure the high precision of micron dimension.
Automatic positioning and focusing system produce high efficiency.




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