MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
Semiconductor & Brittle Materials Industry
Semiconductor & Hard and Brittle Materials Laser Manufacturing Solutions
Product-led laser solutions for semiconductor wafers, SiC wafers, glass, quartz, ceramic substrates, and other hard and brittle materials.
Designed for wafer annealing, stealth dicing, slotting, scribing, marking, inspection, thickness measurement, and precision hard-and-brittle-material processing.
Wafer Processing
SiC Processing
Defect Detection
Glass & Ceramic Processing
Integrated Solutions Overview
Precision laser and inspection solutions for semiconductor and brittle materials
FARLEY LASERLAB provides semiconductor and brittle-material solutions covering wafer annealing, laser modification cutting, slotting, scribing, marking, defect detection, thickness measurement, and precision glass or ceramic processing.
1
Wafer Annealing
Backside metal annealing for SiC wafer device performance.
2
Wafer Cutting & Dicing
Modified cutting, stealth dicing, slotting, and scribing for semiconductor wafers.
3
Wafer Marking
Full-automatic wafer marking for identification and traceability.
4
Inspection & Measurement
Defect detection and thickness measurement for wafers, substrates, and epitaxial wafers.
5
Brittle Material Processing
Glass, quartz, optical glass, ceramic substrate, and other hard-brittle material cutting or drilling.
6
Manufacturing Support
Automation and smart factory support for semiconductor-related production.
Core Equipment
Wafer Laser Annealing
Wafer laser annealing supports backside metal annealing for SiC wafers through coordinated wafer handling, laser annealing, and precision motion control.
- Supports SiC wafer backside metal annealing
- Helps improve ohmic contact
- Designed for fully automated wafer processing
SiC Wafer Modification and Cutting
SiC wafer modification and cutting solutions use custom ultrafast lasers, high-precision motion platforms, dynamic focus compensation, and vision positioning for stealth dicing and die separation.
- Suitable for 6–8 inch wafers
- Supports internal modification and die separation
- Uses vision positioning and automated wafer handling
Advanced SiC Processing
SiC processing supports fully automatic wafer modification and cutting for 6–8 inch wafers, using ultrafast lasers, high-precision CCD vision, dynamic focus compensation, and automated wafer handling.
- Internal modification / stealth dicing
- No front-side damage
- Dynamic focus compensation
- SEMI-standard automation
- Supports advanced third-generation semiconductor manufacturing
Wafer Laser Modified Cutting
Wafer laser modified cutting supports internal modification and stealth dicing of silicon wafers for 8-inch and above chip packaging and testing applications.
- High-quality modified cutting
- Small edge collapse and low surface damage
- Supports high-efficiency wafer separation
Wafer Slotting and Scribing
Wafer slotting and laser scribing solutions support precision processing for low-k wafers, silicon-based GaN wafers, GPP wafers, and silicon or compound semiconductor wafers.
- Supports slotting and precision scribing
- Suitable for semiconductor wafer processing
- Covers nanosecond and picosecond scribing options
Automatic Wafer Laser Slotting Intelligent Equipment
Automatic wafer laser slotting equipment can support precision slotting and advanced wafer processing scenarios within semiconductor manufacturing.
- Wafer slotting
- Precision laser processing
- Semiconductor manufacturing support
Wafer Marking and Traceability
Wafer laser marking solutions support fully automatic marking for semiconductor wafers using wafer handling, coaxial vision positioning, and laser marking technology.
- Supports 2-6 inch wafer marking
- Automatic positioning and edge finding
- Supports identification and traceability
Inspection & Measurement
Inspection and measurement support for semiconductor manufacturing
Inspection and measurement modules help support wafer quality control, substrate defect detection, and raw or epitaxial wafer size and flatness measurement.
Wafer Defect Detection
Semiconductor wafer defect detection equipment supports inspection of patterned wafers and wafer surfaces for scratches, cracks, color differences, metal residue, and other defects.
Value Points: Suitable for 4–8 inch patterned wafers | Detects multiple surface defects | Supports high-resolution inspection
Recommended Products: Wafer Defect Detection Series
Substrate Defect Detection
Semiconductor substrate defect detection equipment supports defect inspection for wafers, substrates, epitaxial wafers, and patterned wafers.
Value Points: Applicable to multiple wafer and substrate types | Detects particles, pits, scratches, stains, and cracks | Supports upstream and midstream quality control
Recommended Products: Defect Detection Series | Semiconductor Substrate Defect Detection Equipment
Wafer Thickness Measuring
Wafer thickness measuring equipment uses spectral confocal measurement to detect the size and flatness of semiconductor raw and epitaxial wafers.
Value Points: Supports raw and epitaxial wafer measurement | Focuses on size and flatness detection | Suitable for upstream semiconductor material production
Recommended Products: Wafer Thickness Measuring Series
Brittle Materials
Glass and Quartz Micro-Drilling
Glass and quartz micro-drilling solutions support high-yield processing of hard and brittle materials using picosecond or short-pulse laser technology.
Suitable for glass and quartz
Supports micro-hole processing
Designed for stable continuous processing
Glass and Optical Material Cutting
Glass and optical material laser cutting solutions support precise, non-contact processing for brittle materials such as cover glass, optical glass, and related components.
Non-contact cutting
Supports complex shapes
Suitable for glass and optical material processing
Glass Laser Welding for Transparent Materials
Ultrafast laser welding can support bonding of glass and transparent brittle materials without additional adhesives in selected precision manufacturing scenarios.
Transparent material welding
No additional adhesive
Low thermal impact
Ceramic Substrate Laser Cutting
Ceramic substrate laser cutting solutions support high-efficiency and high-precision automatic processing for alumina, zirconium oxide, aluminum nitride, silicon nitride, and other ceramic materials.
Suitable for ceramic substrates
Supports automatic loading and unloading
High-speed and high-precision processing
Smart Manufacturing
Semiconductor Intelligent Manufacturing Support
FARLEY LASERLAB supports semiconductor-related intelligent manufacturing through equipment, inspection, automation, and smart factory capabilities for laser processing and quality control.
- Smart Factory
- Inspection Integration
- Data-connected Manufacturing Support
Why FARLEY LASERLAB
Precision laser and inspection capabilities for semiconductor and brittle materials
FARLEY LASERLAB combines wafer annealing, wafer cutting, marking, defect detection, thickness measurement, and brittle-material processing to support semiconductor and precision electronics manufacturing.
Support Cards: Wafer Processing — Annealing, cutting, slotting, scribing, and marking | Inspection & Measurement — Defect detection and thickness measurement | Brittle Material Processing — Glass, quartz, optical glass, and ceramic substrate processing
How We Solve It
Contact
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