MARVEL Series Laser Cutting Machine
SMART Series Laser Cutting Machine
WALC Series Laser Cutting Machine
GF Series Laser Cutting Machine
BF Series Bevel Laser Cutting Machine
Laser Blanking Production Line
PCB & Microelectronics Precision Laser
PCB & Microelectronics Precision Laser Solutions
Product-led laser solutions for PCBA depaneling, PCB/FPC marking, FPC drilling, FPC cutting, IC substrate marking, ceramic substrate cutting, and packaging traceability.
Designed for high-precision, low-stress processing, automated production integration, and traceability management in PCB and microelectronics manufacturing.
PCBA Depaneling
PCB/FPC Marking
FPC Drilling
FPC Cutting
IC Substrate
Ceramic Substrate
Integrated Solutions Overview
Precision laser processing for PCB and microelectronics
FARLEY LASERLAB provides PCB and microelectronics laser solutions covering PCBA depaneling, PCB/FPC marking, FPC drilling, FPC cover film cutting, ceramic substrate cutting, IC substrate X-Out marking, IC package marking, and automation support.
1
PCBA Depaneling
High-precision laser cutting for PCBA production lines.
2
PCB/FPC Marking
Coding, reading detection, and traceability for PCB and FPC boards.
3
FPC Drilling
High-speed micro-hole drilling for FPC and rigid-flex boards.
4
FPC Cutting
Cover film cutting, shape cutting, window half cutting, and RFPC cover opening.
5
IC Substrate & Packaging Marking
X-Out marking, IC surface marking, OCR inspection, and MES data feedback.
6
Ceramic Substrate Cutting
Automatic cutting for alumina, zirconium oxide, aluminum nitride, silicon nitride, and related ceramic substrates.
Core Equipment
SMT Laser Depaneling
SMT laser depaneling solutions support PCBA production lines with offline or inline configurations and fully automatic laser cutting through high-precision control and industrial vision systems.
- No dust and deformation
- Suitable for PCBA production lines
- MES data interoperability
SMT Double Head PCB Laser Marking
SMT double-head PCB laser marking solutions support automatic laser coding, reading detection, and process control for PCBA production lines.
- Supports one-dimensional and two-dimensional codes
- Compatible with PCB/FPC materials and metal shielding covers
- MES interconnection and data anti-duplication
IC Substrate X-Out Laser Marking
IC substrate X-Out laser marking solutions are used for automatic identification and laser marking of scrap units on carrier products.
- Supports scrap-unit identification
- Improves subsequent process identification
- Supports yield and process efficiency improvement
High-Speed FPC Laser Drilling
High-speed FPC laser drilling solutions support high-precision micro-hole drilling for FPC, rigid-flex boards, and related materials
- High-speed micro-hole processing
- Supports blind holes in one hit
- Suitable for FPC shape and cover film processing
FPC Pico UV Laser Cutting
FPC Pico UV laser cutting solutions are used for FPC cover film cutting, FPC shape cutting, FPC window half cutting, and RFPC cover opening.
- High accuracy and stability
- Consistent cutting HAZ effect
- Supports no blackening and no carbonized dust requirements
Ceramic Substrate Laser Cutting
Ceramic substrate laser cutting solutions support high-efficiency and high-precision automatic cutting for alumina, zirconium oxide, aluminum nitride, silicon nitride, and other ceramic materials.
- High-precision ceramic cutting
- Automatic loading and unloading
- Suitable for ceramic substrate processing
Full-Automatic IC Packaging and Laser Marking
Full-automatic IC packaging and laser marking solutions support packaged IC surface marking with automatic loading and unloading, automatic width adjustment, OCR inspection, MES data analysis, and data feedback.
- Automatic IC surface marking
- OCR mark detection
- MES data analysis and feedback
Advanced Packaging
Glass Substrate Processing
Glass substrate processing supports micro-hole drilling, scribing, and precision cutting for advanced packaging and high-density microelectronics applications.
Glass micro-hole processing
Precision scribing and cutting
Supports glass-based advanced packaging development
High-value R&D lead capture
Wafer-Level Laser Processing
Wafer-level laser processing extends PCB and microelectronics solutions toward high-value semiconductor packaging processes, including wafer laser modified cutting, slotting, scribing, and wafer marking.
Upstream process extension
High-precision laser control
Low-stress wafer processing
Higher value for advanced packaging customers
SMT / IC Substrate Laser + Packaging + Inspection Solution
SMT and IC substrate manufacturing can be positioned around laser marking, depaneling, sorting, intelligent inspection, packaging, and traceability-oriented process integration.
Laser + packaging + inspection
IC substrate process support
Traceability and quality control
Smart Manufacturing
Laser + Packaging + Inspection support for PCB and IC substrate manufacturing
FARLEY LASERLAB supports SMT and IC substrate manufacturing with laser marking, depaneling, sorting, intelligent inspection, packaging, and traceability-oriented process integration.
- SMT Laser Depaneling Series
- SMT Double Head PCB Laser Marking Series
- IC Substrate X-Out Laser Marking Series
- Full-automatic IC Packaging and Laser Marking Series
- Smart Factory
Why FARLEY LASERLAB
Integrated capabilities for PCB and microelectronics manufacturing
FARLEY LASERLAB combines precision laser processing equipment, automation modules, inspection support, and traceability-oriented manufacturing capabilities for PCB and microelectronics production.
Precision Laser Processing
SMT/IC Substrate Automation
Traceability and Inspection Support
Contact
Discuss PCB and microelectronics laser processing solutions
Connect with our team to explore laser depaneling, marking, drilling, cutting, IC substrate, ceramic substrate, and smart manufacturing solutions for PCB and microelectronics applications.
Related Products / Solutions
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.
MARVEL Series laser cutting machine delivers excellent cutting precision and high processing speed. The machine produces a very small heat-affected zone, helping to maintain material stability and prevent deformation during cutting. It is suitable for processing a variety of metal materials, including stainless steel, carbon steel, aluminum alloy, iron, and other metal sheets, making it a versatile solution for many manufacturing applications. Price Range: USD $15,000 – USD $35,000.